Search for: All records

The ability of traditional room-conditioning systems to accommodate expanding information technology loads is limited in contemporary data centers (DCs), where the storage, storing, and processing of data have grown quickly as a result of evolving technological trends and rising demand for online services, which has led to an increase in the amount of waste heat generated by IT equipment. Through the implementation of hybrid air and liquid cooling technologies, targeted, on-demand cooling is made possible by employing a variety of techniques, which include but are not limited to in-row, overhead, and rear door heat exchanger (HX) cooling systems. One of the most common liquid cooling techniques will be examined in this study based on different conditions for high-power density racks (+50 kW). This paper investigates the cooling performance of a liquid-to-air in-row coolant distribution unit (CDU) in test racks containing seven thermal test vehicles (TTVs) under various conditions, focusing on cooling capacity and HX effectiveness under different supply air temperatures (SAT). This test rig has the necessary instruments to monitor and analyze the experiments on both the liquid coolant and the air sides. Moreover, another experiment is conducted to assess the performance of the CDU that runs under different control fan schemes, as well as how the change of the control type will affect the supply fluid temperature and the TTV case temperatures at 10%, 50%, and 100% of the total power. Finally, suggestions for the best control fan scheme to use for these systems and units are provided at the conclusion of the study. 

The rapid growth in data center workloads and the increasing complexity of modern applications have led to significant contradictions between computational performance and thermal management. Traditional air-cooling systems, while widely adopted, are reaching their limits in handling the rising thermal footprints and higher rack power densities of next-generation servers, often resulting in thermal throttling and decreased efficiency, emphasizing the need for more efficient cooling solutions. Direct-to-chip liquid cooling with cold plates has emerged as a promising solution, providing efficient heat dissipation for high-performance servers. However, challenges remain, such as ensuring system stability under varying thermal loads and optimizing integration with existing infrastructure. This comprehensive study digs into the area of data center liquid cooling, providing a novel, comprehensive experimental investigation of the critical steps and tests necessary for commissioning coolant distribution units (CDUs) in direct-to-chip liquid-cooled data centers. It carefully investigates the hydraulic, thermal, and energy aspects, establishing the groundwork for Liquid-to-Air (L2A) CDU data centers. A CDU’s performance was evaluated under different conditions. First, the CDU’s maximum cooling capacity was evaluated and found to be as high as 89.9 kW at an approach temperature difference (ATD) of 18.3 ◦C with a 0.83 heat exchanger effectiveness. Then, to assess the cooling performance and stability of the CDU, a low-power test and a transient thermohydraulic test were conducted. The results showed instability in the supply fluid temperature (SFT) caused by the oscillation in fan speed at low thermal loads. Despite this, heat removal rates remained constant across varying supply air temperatures (SATs), and a partial power usage effectiveness (PPUE) of 1.042 was achieved at 100 % heat load (86 kW) under different SATs. This research sets a foundation for improving L2A CDU performance and offers practical insights for overcoming current cooling limitations in data centers. 

Abstract Demand is growing for the dense and high-performing IT computing capacity to support artificial intelligence, deep learning, machine learning, autonomous cars, the Internet of Things, etc. This led to an unprecedented growth in transistor density for high-end CPUs and GPUs, creating thermal design power (TDP) of even more than 700 watts for some of the NVIDIA existing GPUs. Cooling these high TDP chips with air cooling comes with a cost of the higher form factor of servers and noise produced by server fans close to the permissible limit. Direct-to-chip cold plate-based liquid cooling is highly efficient and becoming more reliable as the advancement in technology is taking place. Several components are used in the liquid-cooled data centers for the deployment of cold plate-based direct-to-chip liquid cooling like cooling loops, rack manifolds, CDUs, row manifolds, quick disconnects, flow control valves, etc. Row manifolds used in liquid cooling are used to distribute secondary coolant to the rack manifolds. Characterizing these row manifolds to understand the pressure drops and flow distribution for better data center design and energy efficiency is important. In this paper, the methodology is developed to characterize the row manifolds. Water-based coolant Propylene glycol 25% was used as the coolant for the experiments and experiments were conducted at 21 °C coolant supply temperature. Two, six-port row manifolds' P-Q curves were generated, and the value of supply pressure and the flowrate were measured at each port. The results obtained from the experiments were validated by a technique called flow network modeling (FNM). FNM technique uses the overall flow and thermal characteristics to represent the behavior of individual components. 

The escalating information technology (IT) loads in modern data centers (DCs) present formidable challenges for traditional room-conditioning systems. The heat dissipated from IT equipment has witnessed a significant surge due to the rapid development of data processing, retrieval, and storage, driven by changing technology trends and the growing demand for online services. This evolving landscape poses a substantial burden on air-cooling systems, pushing them to their limits, especially with the prevailing trend of rising power densities in microprocessors and the emergence of hot spots. Amidst these challenges, singlephase cold plate cooling is gaining traction as IT power densities experience a dramatic climb. However, the widespread adoption of this cooling method faces impediments such as the limited availability of chilled water supplies, constrained air distribution pathways, and the absence of elevated floors in many older DCs. In response to these limitations, liquid-to-air (L2A) cooling distribution units (CDUs) have emerged as an alternative method. By incorporating hybrid air and liquid cooling technologies, the industry aims to achieve precise, ondemand cooling through the utilization of various techniques. In the realm of hybrid cooling systems that integrate both air and liquid cooling technologies, a partial failure of the Computer Room Air Handlers (CRAH) introduces unique challenges. Such a failure has the potential to disrupt the delicate balance between air and liquid cooling components, leading to uneven heat dissipation. Moreover, the interdependence of liquid and air cooling in hybrid systems means that even a partial failure can trigger a domino effect, reducing the overall cooling efficiency of the system. This comprehensive study delves into the implications of partial failure in the CRAH unit within the highpower density racks of a hybrid-cooled DC. The investigation explores how this partial failure impacts various critical parameters, including cooling capacity (CC), supply air temperature (SAT), air flow rate, supply fluid temperature (SFT), and thermal testing vehicle (TTV) heater case temperatures. For the purposes of this study, two L2A in-row CDUs were utilized, with a combined total heat load of 129 kW supplied to three racks. The experimental setup is meticulously equipped with the necessary instruments for monitoring and assessing tests on both the liquid coolant and air sides. By addressing these issues, the research contributes valuable insights to the ongoing efforts to optimize data center cooling solutions in the face of evolving IT demands and technological advancements. 

Owing to the dramatic increase in IT power density and energy consumption, the data center (DC) sector has started adopting thermally- and energy-efficient liquid cooling methods. This study examines a single-phase direct-to-chip liquid cooling approach for three high-heat-density racks, utilizing two liquid-to-air (L2A) cooled coolant distribution units (CDUs) and a combined total heat load of 128 kW. An experimental setup was developed to test different types of CDUs, cooling loops, and thermal testing vehicles (TTVs) for different operating conditions. IR images and the collected data were used to investigate the effect of air recirculation between cold and hot aisle containments on the CDU’s performance and stability of supply air temperature (SAT). Three different types of cooling loops (X, Y, and Z) were characterized thermally and hydraulically. Results show that Type Y has the lowest cold plate thermal resistance and pressure drop, among others. In a later test that included a single rack at a heat load of 53 kW and a single CDU, the heat capture ratio for fluid was found to be 94%. Experiments show that using blanking panels on the back of the racks limits hot air recirculation and maintains a steady SAT in the cold aisle. Finally, the CDU performance was evaluated at a high heat load for the three racks at 128 kW, and the average cooling capacity of the units is 58.6 kW, and the effectiveness values for CDU 1 and CDU 2 are 0.83 and 0.82, respectively. 

Growing demands for bio-friendly antifouling surfaces have stimulated the development of new and ever-improving material paradigms. Despite notable progress in bio-friendly coatings, the biofouling problem remains a critical challenge. In addition to biofouling characteristics, mechanically stressed surfaces such as ship hulls, piping systems, and heat exchangers require long-term durability in marine environments. Here, we introduce a new generation of anti-biofouling coatings with superior characteristics and high mechanical, chemical and environmental durability. In these surfaces, we have implemented the new physics of stress localization to minimize the adhesion of bio-species on the coatings. This polymeric material contains dispersed organogels in a high shear modulus matrix. Interfacial cavitation induced at the interface of bio-species and organogel particles leads to stress localization and detachment of bio-species from these surfaces with minimal shear stress. In a comprehensive study, the performance of these surfaces is assessed for both soft and hard biofouling including Ulva , bacteria, diatoms, barnacles and mussels, and is compared with that of state-of-the-art surfaces. These surfaces show Ulva accumulation of less than 1%, minimal bacterial biofilm growth, diatom attachment of 2%, barnacle adhesion of 0.02 MPa and mussel adhesion of 7.5 N. These surfaces promise a new physics-based route to address the biofouling problem and avoid adverse effects of biofouling on the environment and relevant technologies. 

Icephobic surfaces have daily critical impact on human lives in cold climates, with uses ranging from aviation systems and infrastructure to energy systems. However, creation of these surfaces for low-temperature applications remains difficult. Non-wetting, liquid-infused and hydrated surfaces have inspired routes for development of icephobic surfaces. However, high ice adhesion strength (∼20–100 kPa) and subsequent ice accretion, low long-term mechanical and environmental durability and high production cost have restricted their applications. Here, we lay the fundamentals of a new physical concept called stress-localization to develop icephobic surfaces with ice adhesion in the order of 1 kPa and exceptional mechanical, chemical and environmental durability.